Детали новости

Intel Commences Production Shipment of Agilex 7 FPGA Featuring R-Tile

24/05/2023

Intel has commenced shipping of production-qualified volumes of the Intel Agilex 7 FPGA that comes equipped with the R-Tile chiplet, as well as PCIe 5.0 and CXL capabilities. The integration of the R-Tile chiplet in FPGAs enables the creation of more advanced high-performance accelerators. These FPGA accelerators help to offload tasks from the host CPU, thereby freeing up CPU cores while reducing power consumption, resulting in cost savings. The R-Tile's production qualification has initiated the production release sequence for seven device densities across four packages within the Agilex 7 series.

In addition to the R-Tile chiplet, the Intel Agilex 7 FPGA also boasts a host of features that improve overall system performance and power efficiency. For example, PCIe 5.0 support provides faster data transfer rates compared to earlier versions of PCIe, while CXL enables high-speed communication between processors and accelerators.

The integration of R-Tile in FPGAs unlocks new possibilities for designing high-performance accelerators that can handle complex workloads with ease. By offloading tasks from the CPU, these accelerators reduce latency, increase system throughput, and enable faster time-to-insight for applications such as machine learning, data analytics, and scientific computing.

With the production qualification of the R-Tile chiplet, Intel is now able to release seven device densities across four different packages within the Agilex 7 series, providing customers with greater flexibility when selecting the FPGA that best meets their needs. This production release sequence is a testament to Intel's commitment to delivering cutting-edge technology solutions that enable its customers to innovate and stay ahead of the competition.

Agilex 7 FPGA

Теги

перекрестные новости

1. Chinese 5G Networks: Pervasive Coverage and Integr...

Chinese 5G Networks: Pervasive Coverage and Integration into Various Industries

2. Toshiba and Rohm are to invest $2.7 billion in pow...

Toshiba and Rohm are to invest $2.7 billion in power ICs

3. Mediatek's Dimensity 9400: Powering the Future wit...

Mediatek's Dimensity 9400: Powering the Future with Arm’s Cortex-X925 CPU

4. Intel reclaimed the No. 1 spot in 2023

Intel reclaimed the No. 1 spot in 2023

5. Binder Introduces M5 Angled Panel Mount Connectors...

Binder Introduces M5 Angled Panel Mount Connectors to Enhance the 707 Series

6. Why bltouch failed to verify sensor state

Why bltouch failed to verify sensor state

7. Sumco Secures $530M Subsidy for Wafer Plant

Sumco Secures $530M Subsidy for Wafer Plant

8. Changes at TSMC: Chairman Dr. Mark Liu to Retire

Changes at TSMC: Chairman Dr. Mark Liu to Retire

9. Rockley Photonics Successfully Emerges from Chapte...

Rockley Photonics Successfully Emerges from Chapter 11 Bankruptcy with Comprehensive Financial Restructuring

10. Korea's Semiconductor Export Surge in September

Korea's Semiconductor Export Surge in September