IBM and ASMPT researchers have created a novel method of bonding chiplets, which utilizes ultra-thin layers of copper and oxide instead of solder. This technique has the potential to significantly augment data throughput between chiplets, allowing for an increased number of chiplets to be accommodated in a given space.
As a result, this chiplet system can function more like a single SOC, improving its performance and energy efficiency. Moreover, this breakthrough could enable the integration of chiplet technology into smaller devices. The bond produced through this process is approximately 0.8 microns thick, in contrast to the 150-30 microns thickness achieved by solder or a combination of solder and copper.
The new hybrid bonding method developed by IBM and ASMPT has been the subject of great interest within the semiconductor industry, as it can potentially resolve some of the existing limitations of the traditional chiplet architecture. One of the major advantages of this technique is that it enables the creation of highly customized chiplets, which can be easily integrated into a larger system without any significant modification.
Furthermore, this bonding method offers better signal integrity and reduced power consumption, which are critical factors in today's high-performance computing systems. The ultra-thin bond layer also reduces thermal resistance, which may help to mitigate the increasing heat density associated with the shrinking transistor sizes in modern chips.
With these benefits, the hybrid bonding method is expected to play a crucial role in the development of future chiplet-based systems. This technology could lead to greater flexibility in chip design and integration, resulting in more powerful and energy-efficient devices.
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